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lsptechnologies

LSP Technologies

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LSP Technologies gained early recognition for its patented Laser Peen process. Laser peening produces deep, residual compressive stresses in the surfaces of metal parts, delivering increased fatigue life and damage tolerance. The Laser Peen process saw its first production application in 1997 at General Electric Aircraft Engines on a United States military aircraft gas turbine engine blade.

LSPT has since introduced its RapidPeen™ process and associated RapidCoater™ equipment as part of on-going efforts to make laser peening more efficient and cost-effective.

Although laser peening represents the bulk of its business, LSPT is expanding laser technology into exciting, new uses.

  • Laser bond inspection technology (LBI) is being developed to test and verify the strength of adhesives used to bond composite structures within aircraft – a process that will further assure the safety and reliability of airplanes.
  • LBI technology will also be adapted for use with other bonded surfaces, including metals and ceramics.
  • In addition, LSPT is developing a high-energy pulsed laser system for use by the U. S. military in neutralizing land minds from a safe distance.
  • LSPT plans to expand the use of LaserPeen™ processing to extend the service life of many parts and components in airplanes, helicopters, automobiles, heavy transport equipment, orthopedic implants, and a broad range of industrial equipment and machinery. LSPT continues to modify and expand its facilities for production processing of parts and development of new applications.

To date, LSP Technologies has been awarded more than 60 patents for its laser peening technology and equipment. It has also received numerous prestigious awards for its groundbreaking technologies from such organizations as the United States Department of Defense, Ohio Department of Development, and various aerospace industry publications.

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Dublin, Ohio, February 13, 2013 – LSP Technologies, Inc. (LSPT) announces that it has been awarded an SBIR Phase 1 by the US Department of Defense Advanced Research Projects Agency (DARPA).  LBI advances achieved on this program will provide approaches to non-destructively test adhesive bonds in confined areas previously restricted due to access limitations and the small size of features to be inspected.  LSP Technologies’ current Laser Bond Inspection technology can inspect bonds for strength in easily accessible bonded structures.  The technology can also be employed in the detection of kissing bonds.

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